跪求各位大侠：近期接触到DIE BONDING（型号DATACON 2200)我都不懂，谁有相关的操作资料给我，QQ_百度知道
跪求各位大侠：近期接触到DIE BONDING（型号DATACON 2200)我都不懂，谁有相关的操作资料给我，QQ
mail:zhuwei.,我有多少分送多少分！谢谢了
我有更好的答案
就是粘晶，把做好的晶片放在pad预留的位置上，然后固定，之后通过wire bonding把die和lead frame连接，电路就通了。
谢谢，请问您有相关的操作说明书吗
说明书这个很难找到的，你上2ic论坛上面找找看，有没有，那上面东西多，应该有帮助。
我也是操作这台机器的
同样困苦中······
其他类似问题
为您推荐：
bonding的相关知识
等待您来回答
下载知道APP
随时随地咨询
出门在外也不愁DATACON培训_图文_百度文库
两大类热门资源免费畅读
续费一年阅读会员，立省24元！
文档贡献者
评价文档：
DATACON培训
大小：9.73MB
登录百度文库，专享文档复制特权，财富值每天免费拿！
你可能喜欢Product details | Besi
Datacon DS9000e
Datacon DS9000e
The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer formats without having to reinvest in downstream packaging equipment. Besides wafers, the DS9000e handle a variety of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak(R).The DS9000e offers the ultimate combination of performance, flexibility, and versatility, handling the most challenging die sorting applications.
Dual Pick & PlaceParallel processing for high throughput up to 14,500 UPHAdjustable force with synchronized die eject and pickPrecise force control of GaAs, GaN, Si, and thin dieHigh Placement accuracy of ±35 um @ 3 sigmaHandles a broad range of form factors - Bare die to LED PackagesFlexible Wafer Handling300 mm diameter wafers and smallerFilm frame, expander grip ringWaffle pack, Gel-Pak(R) and JEDEC tray carriersAutomated wafer loading and unloading from cassetteElectronic Wafer Map SortingSort known good die by bin gradeAutomatic bar code scanning and wafer map retrievalOn board wafer map translationMulti-project and reticle waferOptional 148 bin multi-cassette outputAutomatic Vision Alignment & InspectionProgrammable strobe LED illuminationBad mark inspection for sorting without electronic mapPre pick and post placement die inspectionEdge chipping, die crack, surface defect and bump inspection capabilitiesCleanroom Mini-Environment EnclosureOptionally availableUS Federal Standard209E Class 100 (ISO 14644-1 Class 5)Ionizers for ESD managementDucted exhaust ports for facility exhaust connectionMappingRow / column and array formatsSECS IIALPSTroughput*Up to 14,500 UPH (150 mm/150 mm with 10& rotary transfer)10,500 UPH (300 mm/300 mm with 15& rotary transfer) - typical Dph for 3 mm x 3 mm die size)InspectionEdge chip detection 2D Bump Place position X, Y, ?Placement accuracy± 35 μm @ 3 sigma ± 1 degree thetaDie size0.5 mm to 5 mm 5 mm to 32 mmCassette input25 slot, 3/16 inch pitch Frames 12 & 8 inchCassette output25 slot, 3/16 inch pitch Frames 8 & 12 inch Carrier plates for waffle packs 2, 3 & 4 inchMachine dimensions1594 x 1422 x 2468 mm (W x D x H) - without multi cassette elevator1900 x 1422 x 2468 mm (W x D x H) - with multi cassette elevator *Application dependentPDF file - 2.45 MB
Besi Netherlands B.V.
+31 26 319 6100
Besi Switzerland AG
+41 41 749 5111
Besi Austria GmbH
Meco Equipment Engineers B.V.
+31 416 384 384Product details | Besi
Datacon 2200 evoplus
Datacon 2200 evoplus
The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.Datacon 2200 evo goes PLUS!PLUS accuracyPLUS productivityPLUS flexibilityMulti-chip capabilityFlexibility for customizingOpen platform architecture
Integrated DispenserPressure/time (Musashi(R)), Auger, Jetter types availableEpoxy stamping optionFilled and unfilled epoxy, wide viscosity rangeSmall footprint, low cost-of-ownershipVision AlignmentNew high-speed image processing unit Full alignment & bad mark searchPre-defined fiducial geometry & customized teachingAutomatic Wafer and Tool ChangerFully automatic cycle for multi-chip productionUp to 7 pick & place tools (optionally 14), 5 eject toolsStamping tools and calibration tools possiblePick & Place HeadDie attach, flip chip and multi-chip in one machineDie pick from: wafer, waffle pack, Gel-Pak(R), feederDie place to: substrate, boat, carrier, PCB, leadframe, waferHot and cold processes supported: epoxy, soldering, thermo-compression, eutecticPerformanceX/Y placement accuracy: ± 7 um @ 3sTheta placement accuracy: ± 0.15° @ 3sUPHDie attach: up to 7,000 UPH/moduleFlip Chip with dipping up to 2,500 UPH/moduleFlip Chip without dipping up to 3,200 UPH/moduleBond HeadsStandard bond head 0° - 360° rotationHeated bond head (optional)FootprintLxDxH: 1,160 mm x 1,225 mm x 1,800 mmStatisticsUptime & 98 %Yield & 99.95 %WaferDie size Die Attach: 0.17 mm - 50 mmDie size Flip Chip: 0.5 mm - 50 mmDie thickness: 0.05 mm - 7 mmWafer size: 2& - 12& (50 mm - 300 mm)Frame size: 5& - 15& (125 mm - 375 mm)Chip TraysWaffle pack / Gel-Pak(R) 2” x 2” and& 4” x 4”JEDEC tray on requestSubstrates and CarriersFR4, ceramic, BGA, flex, boat, lead frame, waffle packGel-Pak(R), JEDEC tray, odd-shape substratesSubstrate working range: 13” x 8”(325 mm x 200 mm)OptionsHardware: Open platform architecture for full customizationSoftware: Single component tracking, CAD download, wafer mapping, substrate mapping, barcode scanner, datamatrix recognition, and more.PDF file - 363.63 KB
Besi Netherlands B.V.
+31 26 319 6100
Besi Switzerland AG
+41 41 749 5111
Besi Austria GmbH
Meco Equipment Engineers B.V.
+31 416 384 384Product details | Besi
Datacon 2200 evo
Datacon 2200 evo
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate
flexibility for die attach as well as for flip chip applications. Equipped with
integrated dispenser, 12” wafer handling, automatic tool changer, and
application specific tooling, the Datacon 2200 evo is prepared for present and future
processes and products.
High Performance at High AccuracyHighest accuracy ± 10 um @ 3 Sigma (7 um on request) High productivity, low cost-of-ownership Up to 4 working heads in one machineMulti-Chip CapabilitySingle pass production for complex products Die attach, flip chip, multi-chip in one machine Epoxy writing & stamping, flux dippingUnbeaten FlexibilityDie pick from wafer, waffle pack, gel pack, feeder Die place to carrier, boat, substrate, PCB, lead frame, wafer Hot and cold processes supported: epoxy, soldering, thermo-compression MCM, SiP, HybridsOpen Platform Architecture for Full CustomizationMost advanced modular platform concept Production line tailored 100% to your needs Ideal solution with smallest footprint possibleMachine Capability X/Y placement accuracy&±10 um @ 3 sigma (7 um on request)Heated bond head (optional)&Up to 350 °CBond force0 – 7,500 g (programmable)&
Wafer &Die sizeDie attach 0.17 mm – 50 mmFlip Chip 0.8 mm – 50 mm&Die thickness0.02 mm – 7 mm&Wafer size4& – 12&&
Tape and Reel Tape width8 mm – 44 mm&
Substrates and Carriers TypesFR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak(R), JEDEC trayWorking range13& x 8&&
Dispenser TypesPressure/time, Volumetric (Auger-screw type), High-performance D-style pump&
Adhesive and Stamping ReservoirEpoxy thicknessSetting range 0.1 mm – 5 mm (0.004& – 0.19&)&
Slide Fluxer Flux film thickness&Various cavity plates available&
Size and Weight*SizeW 1,200 mm x D 1,225 mm x H 2,000 mmWeight1,300 kg *single module without input/output systems
Besi Netherlands B.V.
+31 26 319 6100
Besi Switzerland AG
+41 41 749 5111
Besi Austria GmbH
Meco Equipment Engineers B.V.
+31 416 384 384}